LG Chem has announced the successful development of a liquid photo-imageable dielectric (PID), a critical material for advanced semiconductor packaging. The company is now preparing to meet growing demand in AI and high-performance semiconductor markets. PID is a photosensitive dielectric material that enables the formation of ultra-fine interconnects between semiconductor chips and substrates. By providing reliable pathways for electrical signals, PID enhances circuit fidelity, device performance, and long-term reliability in advanced packaging processes.
Advancing Performance with Liquid PID
As high-performance semiconductors require increasingly denser and more precise circuitry, PID has become indispensable. LG Chem’s liquid PID offers:
*High-resolution patterning for ultra-fine features
*Low-temperature curing for energy-efficient processing
*Low shrinkage and low moisture absorption, improving process stability
*Environmentally compliant formulation, free from PFAS and organic solvents such as NMP and toluene
These features ensure that the material meets both performance and regulatory requirements, supporting the next generation of semiconductor devices.
Film-Type PID: Innovation for Large IC Substrates
To challenge a market historically dominated by Japanese materials makers, LG Chem has leveraged its expertise in film technologies across displays, semiconductors, and automotive electronics to develop film-type PID. The company is now advancing joint programs with leading global semiconductor manufacturers.
As IC substrates grow larger and feature sizes shrink, differences in thermal expansion can increase cracking risks. Conventional liquid PIDs struggle to maintain double-sided uniformity on large panels. LG Chem’s film PID addresses these challenges by:
*Maintaining uniform thickness and pattern fidelity across large substrates
*Offering high strength and elasticity, reducing cracking under thermal cycling
*Ensuring low moisture absorption, supporting long-term reliability
*Enabling seamless adoption with existing lamination equipment without process modifications
Strengthening Back-End Material Portfolio
LG Chem CEO Shin Hak-cheol stated, “LG Chem is proactively addressing our customers’ needs for advanced packaging innovation across a broad materials portfolio. We are committed to going beyond simple material supply to shape new industry trends with our customers.” The company continues to expand mass production and development of key back-end materials for advanced semiconductor packaging, including:
*Copper-Clad Laminate (CCL)
*Die Attach Film (DAF)
*Non-Conductive Film (NCF)
*Build-Up Film (BUF)
As per the press release, through these innovations, LG Chem is reinforcing its leadership in next-generation semiconductor materials, supporting the industry’s push toward higher performance, larger substrates, and environmentally responsible technologies.
