Mitsubishi Chemical Corporation has decided to commercialize ultra-high-purity colloidal silica for use as a raw material in polishing agents for advanced semiconductor manufacturing. The company plans to establish new production facilities at its Kyushu Plant in the Fukuoka Area of Kitakyushu City, Fukuoka Prefecture, with commercial operations scheduled to begin in October 2028. The investment will strengthen Mitsubishi Chemical’s capabilities in high-purity materials for the semiconductor industry, where increasingly precise surface processing is essential for advanced device manufacturing.
Colloidal Silica Supports Semiconductor Wafer Polishing
Colloidal silica serves as an important raw material for surface polishing agents used on silicon wafers. It is also used in chemical mechanical polishing (CMP) slurries for processing interconnect layers on silicon wafers. As semiconductor devices become increasingly sophisticated, manufacturers require highly precise wafer surfaces. During the polishing of silicon wafer wiring layers, manufacturers must simultaneously achieve a high material removal rate, nanoscale surface flatness, extremely low impurity levels and minimal scratching. Therefore, the characteristics of colloidal silica particles—including their shape and physical properties—must be carefully controlled according to the material being polished.
Ultra-High Purity Enables Advanced Semiconductor Applications
Mitsubishi Chemical’s new product uses an ultra-high-purity raw material, tetramethoxysilane, which helps minimise impurity levels during production. The company will manufacture the colloidal silica through an integrated production process, allowing greater control over material quality and consistency. This high-purity approach is particularly important for advanced semiconductor applications, where even extremely small levels of contamination can affect wafer processing and device performance.
Customised Particle Properties for Customer Requirements
In addition to achieving high purity, Mitsubishi Chemical plans to customise the properties of its colloidal silica according to customer requirements. Drawing on its advanced technical expertise and experience accumulated over many years, the company can control key parameters such as particle size and density. The flexibility enables Mitsubishi Chemical to develop colloidal silica materials suited to different semiconductor polishing applications and process requirements.
Supporting the Growth of Advanced Semiconductor Manufacturing
The commercialisation of ultra-high-purity colloidal silica represents another step in Mitsubishi Chemical’s efforts to expand its portfolio of advanced materials for the semiconductor industry. By combining high-purity raw materials, integrated manufacturing and customised particle engineering, the company aims to provide polishing-material solutions that support the increasingly demanding requirements of advanced semiconductor production. As per the press release, with the Kyushu production facilities expected to begin commercial operations in October 2028, Mitsubishi Chemical is positioning itself to meet growing demand for high-performance materials used in next-generation semiconductor manufacturing.
