DIC Corporation unveiled plans to construct a new epoxy resins production facility at its Chiba Plant in Ichihara, Chiba Prefecture. The project has received approval as a “plan for ensuring stable supply” from Japan’s Ministry of Economy, Trade and Industry (METI) under the Act on the Promotion of Ensuring National Security through Integrated Implementation of Economic Measures. The recognition makes DIC eligible for a subsidy of up to ¥3 billion. The plant is scheduled to begin operations in July 2029 and will boost DIC’s annual production capacity for epoxy resins used in semiconductors by approximately 60%.
Epoxy Resins: Critical to High-Tech Applications
Epoxy resins are highly reactive thermosetting synthetic resins known for their superior moldability, heat resistance, electrical insulation, and adhesive strength. These qualities make them indispensable across numerous industries, particularly electronics.
Since starting epoxy resin production in 1968, DIC has supplied advanced materials to the electronics sector, leveraging its polymer design expertise—from raw material development to finished products—and its large-scale manufacturing capabilities. DIC’s epoxy resins are essential for semiconductor fabrication, offering high heat resistance, enhanced dimensional stability, and reduced transmission loss—key properties for supporting the rapid growth of high-speed, high-capacity communications technologies.
Meeting Rising Semiconductor Demand
With global demand for semiconductors continuing to surge, ensuring a stable supply of epoxy resins has become a strategic priority. The current production facility at the Chiba Plant cannot fully meet the anticipated increase in demand. To address this, DIC will build the new plant adjacent to the existing facility. This expansion will not only increase production capacity but also incorporate advanced manufacturing processes designed to improve both product quality and productivity.





























